The MacBook Pro with M2 from Apple includes a new type of cooling. It’s smaller and more efficient. A report by iFixit has now revealed this.
- Apple installed a new type of heat dissipation in the MacBook Pro with M2 chip.
- A better cooling solution could be used due to smaller components.
- However, delivery bottlenecks also played a role as an impetus.
The new MacBook Pro is equipped with the M2 chipset. But that’s not the only innovation in the compact housing. Then Apple equips the notebook with a smaller and yet more effective cooling system.
This emerges from a disassembly that the tech experts from iFixit have now published. They disassembled the notebook and discovered that the “System on a Chip” (SoC) design had been optimized. Smaller, slimmer memory chips in particular ensure less heat development here.
Better heat dissipation
At the same time, the heat-dissipating components could be linked to all heat producers thanks to the space-saving architecture. The result is a cooler notebook with fewer materials. Apple seems to have made a virtue of necessity here.
Because, as iFixit reveals, difficulties in supplying the necessary raw materials played a decisive role in the design of the thermal architecture. The bottom line is that fans can be happy about this this time.
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Tag: macbook issue, macbook pro, macbook release, macbook macos