Apple | MacBook Pro in the iFixit check: Apple shrinks the cooling | macbook

• Apple installed a new type of heat dissipation in the MacBook Pro with M2 chip.
• A better cooling solution could be used due to smaller components.
• However, delivery bottlenecks also played a role as an impetus.

The new MacBook Pro is equipped with the M2 chipset. But that’s not the only innovation in the compact housing. Then Apple equips the notebook with a smaller and yet more effective cooling system.

This emerges from a disassembly that the tech experts from iFixit have now published. They disassembled the notebook and discovered that the “System on a Chip” (SoC) design had been optimized. Smaller, slimmer memory chips in particular ensure less heat development here.

Better heat dissipation

At the same time, the heat-dissipating components could be linked to all heat producers thanks to the space-saving architecture. The result is a cooler notebook with fewer materials. Apple seems to have made a virtue of necessity here.

Because, as iFixit reveals, difficulties in supplying the necessary raw materials played a decisive role in the design of the thermal architecture. The bottom line is that fans can be happy about this this time.

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